News

BlockBeats News, June 15th, according to BlockSec Phalcon (@Phalcon_xyz) analysis, Aztec Network's RollupProcessorV3 contract was attacked, resulting in a loss of over $2.15 million. The root cause was that numRealTxs was not correctly bound to the transaction set enforced by the ZK proof, causing a discrepancy between the proof verification path and the L1 settlement logic's interpretation of the transaction list. The attacker exploited this vulnerability to move real deposits to slots not processed by the settlement logic, bypassing the decreasePendingDepositBalance() function, creating unsecured private balances out of thin air, and then extracting them through the normal settlement process, involving a total of seven assets.

BlockBeats News, June 15th. According to etnews, TSMC will adopt the next-generation semiconductor packaging technology "Panel Level Packaging (PLP)" to compete head-to-head with Samsung Electronics. PLP can significantly improve the production efficiency of AI chips. As TSMC accelerates its production preparation, the power struggle between TSMC and Samsung Electronics, the first to enter this market, seems inevitable. Industry sources revealed on the 15th that TSMC is building the Materials, Components, and Equipment (MCE) supply chain to establish its PLP production system. Currently, TSMC is in discussions with domestic and foreign MCE companies regarding equipment investment. TSMC plans to start PLP mass production as early as next year, seen as a significant step towards this goal. PLP is a technology that cuts the completed circuit-manufactured wafer into individual chips (dies), and then packages them on a rectangular panel to produce the final product. This is in contrast to "Wafer Level Packaging (WLP)" done on circular wafers. When packaging chips on circular wafers, the edge area cannot be used for chips and must be discarded—resulting in lower productivity. Packaging on rectangular panels allows for chip production without waste. Based on a standard 600×600 mm rectangular panel, approximately five to six times more chips can be produced compared to mainstream 300 mm (12-inch) wafers. Currently, Samsung Electronics has a competitive advantage in PLP technology. Samsung Electronics acquired the PLP business from Samsung Electro-Mechanics in 2019 and has continuously built up its technological capabilities by applying this technology to mobile application processors (AP) and power management ICs (PMICs). In contrast, TSMC has been relatively passive in PLP technology in the past because it has established a competitive advantage in the foundry field with traditional Wafer Level Packaging (WLP). However, with the explosive growth of the AI chip market, the situation has reversed—PLP can increase the output of AI chips and is conducive to producing large-area AI chips. Therefore, TSMC has been actively promoting its PLP business since 2024. It is expected that TSMC will complete and operate a pilot production line this year, and after performance evaluation, enter mass production around next year. TSMC has reportedly secured a global AI chip customer. As TSMC accelerates PLP mass production, the competition with Samsung Electronics is expected to intensify. Samsung also plans to expand the application of PLP from existing AP and PMICs to High-Performance Computing (HPC) chips, such as AI semiconductors. In addition, the glass substrate, which is highly regarded as an AI chip substrate, is also likely to be applied in this PLP process—indicating that Samsung Electronics and TSMC will also vie for leadership in the next-generation substrate market. An industry insider stated, "Not only Samsung Electronics and TSMC, but global Outsourced Semiconductor Assembly and Test (OSAT) companies have also significantly entered the PLP process market," and added, "Intense competition is expected, and the market is poised for growth."

BlockBeats News, June 15th, according to Santiment data monitoring, addresses holding at least 10,000 LTC, known as "Whales and Sharks," have increased by about 7% in the past 5 months, showing a continuous accumulation trend. Despite the overall flat price movement, the positions of large holders have been steadily increasing. Based on historical experience, the continued accumulation of such large addresses often leads the overall market trend, as Whales and Sharks typically position themselves before the market fully takes off. If a bull market emerges in the future, this portion of holdings may become a crucial support and drive a rapid recovery in on-chain transaction activity that had previously declined. At the same time, market interest in LTC has recently surged, mainly driven by the LitVM narrative. This project introduces smart contract functionality to Litecoin through the zkLTC wrapping solution, triggering discussions in the market about whether it can bring new demand and new use cases to LTC, and has become one of the core factors driving the current increase in social media hype.